MATERIAL SYSTEMS
Each route is reviewed around the device, production environment and downstream handling—not simply the product name.
ESD + MOISTURE CONTROL
Protection formats for moisture-sensitive and electrostatic-sensitive devices through storage, transport and controlled opening.
Key review points — ESD requirement, barrier level, device quantity, humidity indication, sealing route and label content.
Discuss dry-pack requirements →DEVICE PRESENTATION
Presentation materials selected for device geometry, handling method, automation compatibility and protection.
Key review points — Package outline, pin protection, pocket geometry, peel behaviour and equipment compatibility.
Discuss presentation formats →WAFER + DIE HANDLING
Application-sensitive carriers and protective formats for wafers, die and other high-value components.
Key review points — Wafer or die size, surface sensitivity, cleanliness level, process stage and transport conditions.
Discuss wafer & die handling →CLEANROOM + ESD
Essential consumables for device handling, assembly and inspection operations where contamination and ESD control matter.
Key review points — Particle/lint expectation, ionic contamination, glove material and operating environment.
Discuss cleanroom consumables →FILMS, TAPES + TRACEABILITY
Films, tapes and identification formats that help protect surfaces, support handling and retain product traceability.
Key review points — Adhesive behaviour, removal condition, temperature exposure, label data and conversion format.
Discuss films, tapes & labels →NEED A SPECIFIC ITEM?